Die-Bonders - CeTaQ GmbH Germany

	CeTaQ MCA Service and Consulting
	Printers
	Dispensers
	Chip shooters
	Fine Pitch placers
	Automatical Optical Inspection Systems (AOI)
	Reflow Ovens
	Die-Bonders
	Placement Accuracy with Die from Production
	Z-force under process conditions
	Wire-Bonders
	Laser marking

Machine and Process Capability of Die-Bonders

Placement accuracy with Die from Production

Goal : Evaluate the positionning accuracy of Die component from Production

Measured Parameters : X,Y coordinates

Necessary Materials : CmController, Glassboard, Wafer with Die component

Duration : between 2 and 4 hours depending on number of positionning modules.

Z-Force measurement under process conditions

Goal : Evaluate the placement pressure of placing heads/nozzles

Measured Parameters : Pressure

Necessary Materials : Complete set from CeTaQ for Z-force measurement, chip components from production

Duration : between 1 and 3 hours depending on number of positionning modules.