Z-force under process conditions

	CeTaQ MCA Service and Consulting
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	Z-force under process conditions
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Capability Measurement in SMT

Placement Force Measurement

Driven by the ongoing trend to miniaturization and the quest
for efficient asse

mbly of reliable electronic products, the monitoring of the machine placement force applied to components is moving more and more into the focus of the company’s quality assurance departments.

As the recognized specialists for machine capability analysis in surface mount technology (SMT) we have developed an innovative measuring device which is able to exactly gauge the minute press-on force occurring during the automated component placement operation. A quick and straightforward analysis of the actual placement forces allows to early localizing weak points in this process and therefore can avoid the damage of components.

Measurement Procedure

The measuring device travels over the conveyor into the placement machine like a real PCB. Using an appropriate placement program the customer can place any component that he wants to be checked. These measurements are taking place under normal process conditions, this means that the machine operates the same way as it would populate real boards.

The data received will be analyzed using a special software package. Here, a statistical distribution list of the forces measured will be established, also the force-time sequences of single placement steps can be analyzed.

It goes without saying that the statistical results can be broken down to individual placement heads and nozzles, and will therefore supply detailed information about the placement process.

Technical Data

Length x width 232 x 160 mm (double Europe card size)
Other dimensions are possible, please ask
Headroom over conveyor level 1.6 mm
Clearance under conveyor level 11.8 mm
Force measurement range 0 – 60 N
Placement area 108 cm²
Measurement frequency 10 – 9600 Hz

Benefits

Verification of the placement forces under real production conditions
Using these results for process optimization measures
Detection of possible weak points and elimination of the root causes
Minimization of the defects which occur due to force overload

We offer the measurement of the placement force as a service - as we provide all of our achievements as service to our customers. Or the respective measurement equipment can be purchased through our local offices and representatives.

Now we are also able to evaluate other mechanical measurement categories. These are, for example, the stress at the components during PCB depaneling.

Please ask for more details. We are committed to support you in efficiently resolving your measurement tasks on the shop floor.