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CeTaQ Service and Consulting Wire Bond Measurement  The application of chip-on-board technology is continually increasing, also with products that place high requirements on quality issues such as long-time reliability as automotive electronics call for. The machine capability analysis of wire bonding equipment, which is being used for COB processing, has therefore become more and more important. In order to meet these demands we have developed a method which can precisely measure the XY accuracy of aluminum thin wire bonding equipment. With this approach it is now possible to get reliable results on the accuracy of the bonding equipment under real process conditions for the first time ever. Method A 4 x 4 inches glass gauge plate is used for the measurement, and it will be loaded into the machine just as a real product. Using a particularly generated bonding program multiple products will be bonded. The measurements of the source and of the destination bonds then can follow afterwards. The analysis of the results allows drawing conclusions about the machine accuracy in general. In the same way it is possible to identify dependencies in relation to bonding direction or position. A reliable conclusion on the machine stability is gained by multiple bonding and measurement procedures. Technical Data
Benefits
We offer the measurement of the bonding machine accuracy as a special service - as we provide all of our achievements as service to our customers. At the present time we are developing a solution for the measurement of the accuracy of gold wire bonding equipment. |
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